Event covering the entire data center value chain, from facility design and IT infrastructure to business implications, with a focus on emerging markets and high-growth sectors.
Vertiv, a global provider of critical digital infrastructure and continuity solutions, including power, cooling and end-to-end services for artificial intelligence (AI) deployments, announced its position as a Gold Sponsor for the inaugural edition of Data Center Nation (DCN) Dubai 2024, on 14th May in Madinat Jumeirah. The event marks a significant milestone for the data center industry in the UAE and the Gulf region, offering a unique platform designed for expanding and rapidly evolving markets.
Vertiv stands out with innovative cooling technologies that address the pressing needs of modern data centers, including those struggling with heat generated by AI and HPC (high-performance computing). Vertiv’s participation highlights the company’s commitment to the region, with many of its key regional clients, consultants and partners in attendance.
Tassos Peppas, Regional Director for Middle East, Turkey and Africa (METCA) at Vertiv, said: “Vertiv has a successful history with Data Center Nation events in other countries, so we were happy to sponsor the inaugural Data Center Nation event in Dubai. This is a great opportunity to network with our customers and showcase our latest innovations in power and cooling to support AI.
“Vertiv is a leader in the Middle East AI market, with a number of AI projects under our belt. Our AI-ready critical digital infrastructure is designed to meet the AI needs of edge and enterprise, commercial and industrial, hyperscalers and colos segments,” said Peppas.
Vertiv’s Nigel Gore, Senior Director, Global High Density & Liquid Cooling, will speak at the event, with his presentation “Emerging Technologies Impacting the Middle East Data Center Landscape”. He will discuss AI-ready cooling solutions. A technology, direct-on-chip liquid cooling, in which the Vertiv Liebert HPC such as central processing units (CPU). ) and graphics processing units (GPU). This method can dissipate up to 75% of the heat generated by the equipment.
The second technology, rear door heat exchangers, Vertiv Liebert DCD, are available in passive or active cooling models, replacing the rear doors of traditional IT racks with a system that efficiently dissipates heat from the rack equipment. This solution is often adopted in existing data centers, as the door is compact and easy to install, causing minimal disruption to data center operations.
The solutions are designed to handle higher density workloads and challenging deployments and operate with high energy efficiency and reliability.
Nigel Gore, Senior Director, Global High Density & Liquid Cooling at Vertiv, said: “In a landscape where the boundaries of digital infrastructure continue to expand, our pioneering cooling solutions are at the forefront of the evolution of the sector. They mark a proactive step toward mastering the thermal challenges posed by AI and accelerated computing, supporting our unwavering commitment to advancing data center efficiency and performance.
Vertiv’s robust portfolio of offerings is supported by comprehensive technology expertise, continuous research and development, global manufacturing capabilities and an extensive services organization. Vertiv also partners on design and development with industry leaders, including NVIDIA and Intel, leveraging combined expertise to solve challenges supporting AI infrastructure. This combination uniquely positions Vertiv to effectively address the complex power and cooling needs of AI workloads. As digital transformation continues to drive the evolution of technology infrastructure, Vertiv’s AI-ready solutions are ready to support and enhance high-performance computing deployments across the world.
Meet the Vertiv team of experts on stand n°7 all day long. Join Nigel Gore’s opening session from 12:25 p.m. to 1 p.m.
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