Shanghai, China, May 13, 2024 /PRNewswire/ — DuPont today announced that it will showcase its full range of advanced circuit materials and solutions at the 2024 International Electronic Circuits Show in Shanghai. With a product portfolio including fine lines, signal integrity, power and heat management, DuPont will be exhibiting at Kiosk #8L06 at the National Exhibition and Convention Center (NECC) of May 13 to 15.
Driven by the rapid increase in data generation, the demand for high-throughput devices powering artificial intelligence (AI) continues to skyrocket. DuPont is at the forefront of innovation with cutting-edge solutions for advanced packaging and integrated circuit (IC) substrates, two crucial components for AI accelerators and high-performance computing applications. Collaborations with OEMs and major industry players have yielded groundbreaking results, such as the development of glass substrate technology and a micro-bump SnAg solution for high-bandwidth memory (HBM) new generation adapted to AI applications.
“Our new technology solutions demonstrate DuPont’s ability to drive innovation and create value in partnership with industry leaders in the AI sector. As a one-stop powerhouse for advanced interconnect solutions, from chip packaging, IC substrate, advanced PCBs to assembly, we are well-equipped to enable our customers to push the boundaries of based technologies on AI. We are excited to showcase our product portfolio at this year’s Electronic Circuits Show,” said Yuan Yuan Zhou, Global Business Manager, Advanced Circuit & Packaging, DuPont.
As the PCB industry rapidly evolves, it faces challenges such as miniaturization, signal integrity, and thermal management for high-speed, high-frequency connectivity. DuPont’s comprehensive solutions are designed to address these challenges with advanced materials and chemistry for flexible, rigid-flexible, rigid PCBs, IC substrates and advanced packaging.
At the show, DuPont experts will share their in-depth knowledge and expertise on technological advancements and industry trends. Attendees will have the opportunity to explore DuPont’s portfolio of comprehensive solutions for the PCB industry, which includes the following product offerings:
DuPont™ Circuposit™ SAP8000 Electroless Copper is an innovative SAP metallization technology specifically designed for AI CPU or GPU chip applications. This ionic catalyst-based electroless copper process is optimized for advanced packaging, including high-end CPUs or GPUs, to meet the requirements for low roughness dielectrics and low Dk and Df properties, which are essential for fine line and high frequency designs.
DuPont™ Acid Plating Copper Microfill™ SFP-II-M is a cutting-edge pattern matching solution, specifically designed to ensure optimal pattern distribution for large AI chips. Designed for high-performance computing applications, this new plating solution provides consistent pattern distribution across large units, delivering superior performance and reliability.
DuPont™ Riston® Dry film photoresist DI1600 and DI1600M are advanced photoresist solutions that enable direct fine-line imaging for IC substrate applications. They offer exceptional adhesion and resolution on fine lines, combined with high-throughput performance, making them the ideal choice for advanced IC substrate production.
DuPont™ Solderon™ TS7000 Series Solder is a SnAg micro-bump plating solution, specially formulated for HBM applications. It offers exceptional coplanarity performance, making it the ideal choice for mixed bump and fine-pitch micro-bump applications. Additionally, the BP7000 series can accommodate both soluble and insoluble electrode plating solutions, adding to its versatility.
DuPont™ CYCLOTENE™ 3300 3D Encapsulant is a hybrid copper-copper bonding solution designed for next-generation HBM applications. This self-priming material eliminates the need for a separate adhesion promotion process and provides excellent material properties. With good uniformity and filling capacity, it enables heterogeneous 3DIC structures that meet customer requirements and meet the reliability essential to quality specifications.
Laird™ Tpcm™ 7000, a high performance phase change material, is preferred for AI applications for its excellent thermal performance and long-term reliability, even at high temperatures and on non-coplanar contact surfaces. It provides solutions for more efficient, longer-lasting and more secure AI chips that meet the needs of data centers.
About DuPont Electronics and Industrial
DuPont Electronics & Industrial is a global provider of new technologies and performance materials serving the semiconductor, printed circuit, display, digital and flexographic printing, healthcare, aerospace, industry and transport. From advanced technology centers around the world, teams of talented scientific researchers and applications experts work closely with customers, providing solutions, products and technical services to enable next-generation technologies. http://electronics.dupont.com.
About DuPont
DuPont (NYSE: DD) is a global leader in innovation with materials and technology solutions that help transform industries and everyday life. Our employees apply diverse sciences and expertise to help customers advance their best ideas and deliver critical innovations in key markets including electronics, transportation, construction, water, healthcare and security workers. More information about the company, its activities and its solutions is available at www.dupont.com. Investors can access information included in the Investor Relations section of the website at investors.dupont.com.
DuPont™, the DuPont oval logo and all trademarks and service marks marked with ™, SM Or ® are owned by affiliates of DuPont de Nemours, Inc., unless otherwise noted.
SOURCE DuPont
